ZutaCore bagged another $100 million in funding, with investments from Mitsubishi Electric, Carrier Ventures, and Samsung Electronics (via its CVC arm, Samsung Ventures) set to support the global commercial expansion of its technology.
The company provides two-phase direct-to-chip liquid cooling, and already has more than 75 deployments across the Americas, Europe and Asia. Now it's looking to scale to serve rapidly growing bookings and deployments driven by rising demand for AI and high-performance computing (HPC) infrastructure.
The funding will also help it advance R&D to address the evolving thermal requirements of next-generation chip architectures, with a particular eye toward driving innovation in in-package thermal management and enabling seamless two-phase integration with existing air and single-phase systems.
It's platform is already designed to serve processors exceeding 4,000 watts, but the goal is to support megawatt-class deployments.
To help steer its growth, the company hired a new CFO, COO, Chief Research and Development Officer and Chief People Officer.
Read the full press release here.